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Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certificaten
China Dongguan Ziitek Electronic Materials & Technology Ltd. certificaten
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Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance
Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

Grote Afbeelding :  Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

Productdetails:
Plaats van herkomst: CHINA
Merknaam: ZIITEK
Certificering: UL and RoHs
Modelnummer: TIF100-10-01U-serie
Document: TIF100-10F_Data Sheet.pdf
Betalen & Verzenden Algemene voorwaarden:
Min. bestelaantal: 1000 STUKS
Prijs: Onderhandelbaar
Verpakking Details: 1000 STKS/ZAK
Levertijd: 3-5Work Days
Betalingscondities: T/T
Levering vermogen: 10000/dag

Thermal Conductive Pad for Heat Dissipation in Electronic Devices Ensuring Thermal Management and Enhanced Performance

beschrijving
Producten Naam: Thermisch geleidend kussen voor warmteafvoer in elektronische apparaten, wat zorgt voor thermisch be Continu Gebruik Temp: -40 ℃ tot 200 ℃
Dikte: 2,1 g/cm³ Sollicitatie: Warmteafvoer in elektronische apparaten
Hardheid: 65/60 Kust 00 Trefwoorden: Thermisch Geleidend Stootkussen
Kleur: Grijs Thermische geleidbaarheid en compositie: 1,5 W/mK
Dikte: 0,010 ~ 0,20 inch / 0,25 ~ 5,0 mmt Bouw: Keramisch gevuld siliconenelastomeer

Thermal Conductive Pad for Heat Dissipation in Electronic Devices
TIF®100-10F Series is a structurally supportive thermal pad designed to provide excellent heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation.
Key Features
  • Excellent thermal conductivity: 1.5W/mK
  • Good softness and fillability
  • Self-adhesive without additional surface adhesives
  • Good insulation performance
Applications
  • Heat dissipation structure for radiators
  • Telecommunication equipment
  • Automotive electronics
  • Battery packs for electric vehicles
  • LED TV and lamps
  • Telecommunication hardware
  • Home appliance industry
  • Power module
  • Wearable devices
  • Solar photovoltaic panels
  • LED lighting fixtures
Technical Specifications - TIF®100-10F Series
Property Value Test Method
Color Gray Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.1 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.0
ASTM D374
Hardness (Shroe 00) 65 | 60 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Dielectric Constant @ 1MHz 4.5 ASTM D150
Volume Resistivity >1.0×10¹² Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 1.5 W/m-K ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Component Codes:

Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
TIF®100-10F Series Thermal Conductive Pad product image
Packaging & Lead Time

Packaging Details:

  • PET film or foam protection
  • Paper card separation between layers
  • Export carton packaging (inside and outside)
  • Customized packaging available per customer requirements

Lead Time:
Quantity: 5000 pieces
Estimated Time: To be negotiated

Company Profile
Dongguan Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solutions and manufacturing superior thermal interface materials for competitive markets. Our vast experience allows us to best assist customers in thermal engineering. We serve customers with customized products, full product lines, and flexible production, making us your best and most reliable partner. Let's make your design more perfect!
Certifications
  • ISO9001:2015
  • ISO14001:2004
  • IATF16949:2016
  • IECQ QC 080000:2017
  • UL Certified
Why Choose Ziitek?
  • Our value message: "Do it right the First time, total quality control"
  • Core competency: Thermal conductive interface materials
  • Competitive advantage products
  • Confidentiality agreement and business secret contracts
  • Free sample offerings
  • Quality assurance contracts

Contactgegevens
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contactpersoon: Dana Dai

Tel.: +86 18153789196

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