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Productdetails:
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| Productnaam: | Thermal Gap Filler ontworpen om de thermische geleidbaarheid te verbeteren en de levensduur van elek | Bouw: | Keramisch gevuld siliconenelastomeer |
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| Analysesterkte (V/mm): | ≥5500 | Sollicitatie: | elektronische componenten |
| Steekproef: | Monster gratis | Aanbevolen bedrijfstemperatuur (°C): | -40 aan 200℃ |
| Warmtegeleidingsvermogen (w/mk): | 3.0W/mK | Hardheid: | 65/45 Kust 00 |
| Vlamwaardering: | UL 94 V-0 | Trefwoorden: | Thermische gap -vulstof |
| Markeren: | Thermal gap filler for electronics,Thermal conductivity gap filler,Long-term service gap filler |
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Thermal Gap Filler Designed To Improve Thermal Conductivity And Extend Service Life Of Electronic Components Product Overview The TIF® 100-30-15S Series is a well-balanced, general-purpose thermal pad offering high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic
Contactpersoon: Dana Dai
Tel.: +86 18153789196
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