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Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certificaten
China Dongguan Ziitek Electronic Materials & Technology Ltd. certificaten
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Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices
Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

Grote Afbeelding :  Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

Productdetails:
Plaats van herkomst: China
Merknaam: ZIITEK
Certificering: UL and RoHs
Modelnummer: TIF100L 3040-06
Document: TIF100L 3040-06_Data Sheet.pdf
Betalen & Verzenden Algemene voorwaarden:
Min. bestelaantal: 1000 stuks
Prijs: Onderhandelbaar
Verpakking Details: 1000 STKS/ZAK
Levertijd: 3-5Work Days
Betalingscondities: T/T
Levering vermogen: 10000/dag

Low Volatility Thermal Gap Filler Pads Ensuring Thermal Management And Long Term Operation Stability In Electronic Devices

beschrijving
Productnaam: Thermische vulpads met lage vluchtigheid die thermisch beheer en langdurige werkingsstabiliteit in e Bouw: Keramisch gevuld siliconenelastomeer
Trefwoorden: de thermische stootkussens van de hiaatvuller Hardheid: 65/40 Kust 00
Aanbevolen bedrijfstemperatuur (°C): -40 aan 200℃ Doorslagspanning: ≥5500
Steekproef: Monster gratis Warmtegeleidingsvermogen (w/mk): 3.0W/mK
Vlamwaardering: UL 94 V-0 Sollicitatie: Elektronische apparaten

Low Volatility Thermal Gap Filler Pads
Product Overview

The TIF®100L 3040-06 Series is an ultra-low silicon oxygen volatilization thermal pad designed specifically for the thermal management needs of optical and high-precision electronic devices. This material balances efficient thermal conductivity with extremely low precipitation of condensable volatile substances, effectively avoiding pollution to sensitive optical components and precision circuits.The material features excellent flexibility and elasticity, enabling it to fully fill micro gaps between heating interfaces and heat dissipation structures. This significantly reduces contact thermal resistance, improves thermal conductivity efficiency, and ensures the reliability and service life of electronic components in long-term operation.

Key Features
  • Ultra low volatility of siloxane
  • Good thermal conductivity
  • Excellent weather resistance and aging resistance
  • Highly compressible, easy to install and operate
  • Good insulation performance
Applications
  • Motor Controller (MCU)
  • Airborne computer
  • Machine vision camera
  • High performance ASIC chip
  • Central control screen
Technical Specifications of TIF100L 3040-06 Series
Property Value Test Method
Color White Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 3.0 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00
ASTM D374
Hardness (Shore 00) 65 | 40 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥5500 ASTM D149
Volume Resistivity (Ohm-meter) >1.0×10¹² ASTM D257
Flame rating V-0 UL 94 (E331100)
∑ZD3-D10 (PPM) <100 GC-MS
Thermal conductivity (W/m-K) 3.0 ASTM D5470
ISO22007
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm), with increments of 0.010" (0.25 mm).

Standard Size: 16"×16" (406 mm×406 mm)

The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.

TIF 100L 3040-06 Thermal Gap Filler Pad product photo
Packaging & Lead Time

Packaging Details:

  • With PET film or foam for protection
  • Paper card to separate each layer
  • Export carton inside and outside
  • Customized packaging available to meet customer requirements

Lead Time:

Quantity: 5000 pieces

Estimated Time: To be negotiated

Frequently Asked Questions
Q: What thermal conductivity test method was used to achieve the values given on the data sheets?
A: A test fixture is utilized that meets the specifications outlined in ASTM D5470.
Q: Is GAP PAD offered with an adhesive?
A: Currently, most thermal gap pad surfaces have double side natural inherent tack. Non-stick surface can also be treated according to customer's requirements.
Q: Are you trading company or manufacturer?
A: We are manufacturer in China.

Contactgegevens
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contactpersoon: Dana Dai

Tel.: +86 18153789196

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