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Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components

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Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components

Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components
Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components
Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components

Grote Afbeelding :  Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components

Productdetails:
Plaats van herkomst: CHINA
Merknaam: ZIITEK
Certificering: UL and RoHs
Modelnummer: TIF100-11S
Document: TIF100-11S_Data Sheet.pdf
Betalen & Verzenden Algemene voorwaarden:
Min. bestelaantal: 1000 STUKS
Prijs: Onderhandelbaar
Verpakking Details: 1000 STKS/ZAK
Levertijd: 3-5Work Days
Betalingscondities: T/T
Levering vermogen: 10000/dag
Contact

Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components

beschrijving
Naam van product: Thermisch geleidend kussen ontworpen om warmteafvoer en elektrische isolatie te bieden voor elektron Brandclassificatie: UL 94 V-0
Trefwoorden: Thermisch Geleidend Stootkussen Thermische geleidbaarheid: 1,5 W/mK
Doorslagspanning (V/mm): ≥5500 Dielectrische constante @1MHz: 4.5
Constructie & Compostie: Keramisch gevuld siliconenelastomeer Continu Gebruik Temp: -40 aan 200℃
Sollicitatie: Elektronische componenten met hoog vermogen Steekproef: vrij

Thermal Conductive Pad Designed to Provide Heat Dissipation and Electrical Insulation for High Power Electronic Components
Product Overview

The TIF® 100-11S Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components.

Key Features
  • Good thermal conductivity: 1.5W/mK
  • Moldability for complex parts
  • Soft and compressible for low stress applications
  • Naturally tacky, requiring no additional adhesive coating
  • Available in various thicknesses
Applications
  • Cooling components to chassis or frame
  • High speed mass storage drives
  • Heat sinking housing at LED-lit BLU in LCD
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Display cards
  • Mainboards/motherboards
  • Notebook computers
Typical Properties of TIF® 100-10S Series
Property Value Test Method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicone elastomer ******
Density (g/cm³) 2.3 ASTM D792
Thickness Range (inch/mm) 0.010~0.020 | 0.030~0.200
0.25~0.50 | 0.75~5.00		 ASTM D374
Hardness 65 Shore 00 | 45 Shore 00 ASTM 2240
Continuous Use Temp -40 to 200℃ ******
Breakdown Voltage (V/mm) ≥ 5500 ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity ≥1.0×10¹² Ohm-meter ASTM D257
Thermal Conductivity (W/m-K) 1.5 ASTM D5470
ISO22007
Fire Rating V-0 UL 94 (E331100)
Product Specifications

Standard Thickness: 0.010" (0.25 mm) – 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm × 406 mm)

Component Codes

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

TIF® Thermal Conductive Pad product image
Company Profile

Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Our thermal conductive materials are widely used in new energy, electronic appliances, transportation, industry, healthcare, communication, and other fields.

Ziitek has obtained ISO9001, ISO14001 and IECQ certifications, demonstrating our commitment to producing high-quality products and adopting excellent management methods. Our products comply with RoHS, REACH and UL standards, ensuring safety and reliability.

Manufacturing Capabilities

Factory Size: 8,000–10,000 square meters

Factory Location: No.12, Xiju Road, Hengli Township, Dongguan City, Guangdong Province, P.R.China

Customer Service

Online Service: 12 hours, with fastest inquiry reply times

Working Hours: 8:00am - 5:30pm, Monday to Saturday (UTC+8)

Staff: Well-trained and experienced English-speaking team

Packaging: Standard export carton or customized with customer information

Samples: Free samples provided

After-Service Support

Even though our products undergo strict inspection, if you encounter any issues with parts not working properly, please provide proof and we will help resolve the situation with a satisfactory solution.

Ziitek Culture

Quality: Do it right the first time, total quality control

Effectiveness: Work precisely and thoroughly for effectiveness

Service: Quick response, on-time delivery, and excellent service

Teamwork: Complete teamwork across sales, marketing, engineering, R&D, manufacturing, and logistics teams to provide satisfying service for customers

label:

thermaal geleidende vuller,

warmtegeleidingsvermogensilicone,

materialen de op hoge temperatuur van de faseverandering

Contactgegevens
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contactpersoon: Dana Dai

Tel.: +86 18153789196

Direct Stuur uw aanvraag naar ons (0 / 3000)

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