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Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics

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China Dongguan Ziitek Electronic Materials & Technology Ltd. certificaten
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Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics

Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics
Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics
Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics

Grote Afbeelding :  Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics

Productdetails:
Plaats van herkomst: China
Merknaam: ZIITEK
Certificering: UL and RoHs
Modelnummer: TIF100-50-11F
Document: TIF100-50-11F_Data Sheet.pdf
Betalen & Verzenden Algemene voorwaarden:
Min. bestelaantal: 1000 STUKS
Prijs: Onderhandelbaar
Verpakking Details: 1000 STKS/ZAK
Levertijd: 3-5Work Days
Betalingscondities: T/T
Levering vermogen: 10000/dag
Contact

Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics

beschrijving
Productnaam: Donkergrijze thermische spleetvuller met een thermische geleidbaarheid van 5,0 W/mK voor effectief t Dikte: Beschikbaar varieert binnen Thicknes
Thermische geleidbaarheid: 5.0 w/m-k Bouw: Keramisch gevuld siliconenelastomeer
Dikte: 3.4 g/cm³ Trefwoorden: Thermische gap -vulstof
Model: TIF100-50-11F Sollicitatie: Voor effectief thermisch beheer in de elektronica
Kleur: Donkergrijs

Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics


Company Profile


Dongguan Ziitek Electronic Material and Technology Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


Products description


The TIF®100-50-11F  Series is a structurally supportive thermal pad designed to provide high heat dissipation while also ensuring structural support and durability. It can reliably fill interface gaps, transfer heat, and offer mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation,insulation, and mechanical stability.


Features:


>  Good thermal conductive: 5.0 W/mK 
>  Naturally tacky needing no further adhesive coating 
>  Soft and Compressible for low stress applications
>  RoHS compliant
>  UL recognized


Applications:


>  Mainboard/mother board
>  LED TV and LED-lit lamps
>  RDRAM memory modules 
>  Micro heat pipe thermal solutions 
>  Automotive engine control units
>  Automotive electronics
>  New energy vehicle
>  Motherboard chip
>  Radiator
>  AI Processors AI Servers


Typical Properties of TIF®100-50-11F Series
Property Value Test method
Color Dark gray Visual
Construction Ceramic filled silicone elastomer ******
Density(g/cm³) 3.3 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00 60 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.5 MHz ASTM D150
Volume Resistivity ＞1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 5.0 W/m-K ASTM D5470
5.0 W/m-K ISO22007

Products specification


Standard Thickness: 0.010"(0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size:16"×16" (406 mm×406 mm).


Component Codes:


Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF® series is available in custom shapes and various forms.

For other thicknesses or more information, please contact us.


Dark Gray Thermal Gap Filler With 5.0W/mK Thermal Conductivity For Effective Thermal Management In Electronics 0

Packaging Details & Lead time


The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized


Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated


Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete  teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

 

FAQ: 


Q: How do I place an order? 

A:1. Click the "Sent messages" button to continue with the process. 

2. Fill out the message form by entering a subject line, and message to us.  

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us 

4. We will reply you as soon as possible with Email or online 


Q: How do I request customized samples? 

A: To request samples, you can leave us message on website, or just contact us by send email or call us. 


Q: What's the thermal conductivity test method given on the data sheet ? 

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity. 

label:

thermaal geleidende vuller,

warmtegeleidingsvermogensilicone,

materialen de op hoge temperatuur van de faseverandering

Contactgegevens
Dongguan Ziitek Electronic Materials & Technology Ltd.

Contactpersoon: Dana Dai

Tel.: +86 18153789196

Direct Stuur uw aanvraag naar ons (0 / 3000)

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